Finland's TactoTek hosts IMSE Days 2.0 in June
TactoTek, the global leader in injection molded structural electronics (IMSE) technology, with support from MacDermid Performance Solutions, Altium and Niebling, and presenters from across the in-mold electronics ecosystem will convene the IMSE Days 2.0 conference on June 5, 2019 in Oulu, Finland.
- Demand for IMSE solutions, single piece seamless parts that integrate electronic functions including touch controls, lighting and wireless communications, within 3D injection molded structures, is growing quickly across markets, including automotive, industrial, smart home and consumer use cases, says Dave Rice, SVP Marketing at TactoTek
Conference participants span the IMSE ecosystem, including OEMs/brands and their suppliers, and representatives of the design systems, materials, equipment, and testing solutions that support to successfully IMSE design and mass production.
Announced speakers at IMSE Days 2.0 include Faurecia, Novem, Bö-La, OSRAM, Cypress Semiconductor, MacDermid, Covestro, OptoFidelity, TactoTek, and will include presentations and live demonstrations of printed electronics and mechanics computer-aided design (CAD) from Altium and Dassault Systémes. In addition to presentations, leaders in printed electronics materials will be available to share their knowledge during the event.
- In this conference, market leaders report on their experiences with IMSE technology, and experts in IMSE design, production and testing share their insights. It’s a very efficient way to advance your knowledge about in-mold electronics in general and IMSE in specific, and learn what it takes to succeed, notes Sini Rytky, VP Product Management for TactoTek.
To learn more about IMSE Days 2.0 and register online, visit: https://tactotek.com/imse_days_20/
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